Product description:
　　Used in fields such as semiconductor silicon wafer grinding and single-crystal silicon processing.
　 　Product features:
　　Using ceramic grinding discs to grind semiconductor silicon wafers has become the most scientifically sound grinding method today. In the production of semiconductor silicon wafers, a double-sided grinding process is employed to grind the sawed wafers. By optimizing the grinding process—including the material of the grinding disc, the grinding slurry, the grinding pressure, and the grinding speed—wafer quality can be significantly improved. Replacing cast-iron grinding discs with ceramic ones prevents scratches or contamination on the main surface of the wafer during grinding, reduces the introduction of metal ions, thereby decreasing the amount of subsequent processing required for the wafers, shortening the duration of follow-up processes (such as etching), enhancing production efficiency, minimizing wafer processing losses, and improving wafer utilization.

　 　Technical indicators:

　 　Product Specifications:
　　② High-purity alumina discs and rings with a thickness of 45 mm or less and a diameter of 850 mm (custom-sized machining available)
　 　Our company can also produce high-end ceramics in the following specifications:
　　1. Long boards, long strips, square boards, and thin boards with dimensions of 1500×600×25mm or less;

　　2. Rails measuring 1000×45×45 mm or smaller;
　　3. Empty tubes, cylinders, and electron vacuum tubes with dimensions of 800×1000 mm or less;
　　4. Custom-made irregular-shaped components of various forms.
　　Our strengths:
　　Zibo Hongrun can provide various wear-resistant ceramic technology solutions.